From September 21 to 23 local time, ECOC 2026 (the European Conference on Optical Communications), Europe's largest and most influential optical communications event, officially opened at the FYCMA exhibition center in Malaga, Spain. As a core global enterprise in optical communications, Accelink is making a strong appearance with cutting-edge high-speed optical interconnect technologies and products (booth: #1007). Focusing on the core demand for high-speed, high-efficiency interconnection of AI compute clusters, Accelink is showcasing three core achievements: 12.8T ultra-dense liquid-cooled pluggable optical modules, 6.4T NPO (near-packaged optics) solutions, and 400G/Lane technology, exploring with global industry partners the new trends of optical communications and the future of compute networks in the AI era.
Core Technologies Take the Stage-Solving the AI Cluster Interconnection Energy-Efficiency Challenge
At this year's ECOC, Accelink publicly demonstrated for the first time the ultimate performance of its 12.8T XPO liquid-cooled pluggable optical module. Its striking real-world test results and disruptive product advantages quickly made it the highlight of the booth, drawing crowds of industry engineers, technical experts and representatives from leading vendors.
Unlike the traditional static exhibits common in the industry, this 12.8T XPO demo is presented as a fully dynamic, visual experience: the liquid-cooling platform runs live on-site, and all 64x200G channels are tested in real time with BER results displayed. Through its on-site liquid-cooling circulating test platform, Accelink intuitively demonstrates the module's transmission quality and energy efficiency.
As a cornerstone technology for the evolution of next-generation AI compute networks, Accelink also exhibited 400G/Lane rate technology. Widely regarded as a key technical node for next-generation 3.2T pluggable optical modules, it helps the industry build a faster, smarter and more efficient AI compute interconnection system.
Meanwhile, addressing the need for system-level energy-efficiency upgrades in compute networks, Accelink showcased its 6.4T NPO (near-packaged optics) solution. With its low electrical-link loss, high integration density and excellent energy efficiency, this solution is expected to break through the bottlenecks of traditional optical interconnects and enable the restructuring and optimization of existing optical interconnect architectures.
Lively On-Site Exchange-Joining Global Partners to Open New Compute Opportunities
During the exhibition, the Accelink booth attracted customers from around the world. The on-site team held in-depth discussions with visiting guests on the technical advantages, application scenarios, deployment value and future iteration directions of the three core technologies, exchanged views on industry hotspots, listened closely to the real business needs of overseas customers, and explored diverse cooperation possibilities.
Facing the interconnection challenges brought by the continuous explosion of AI compute, Accelink keeps increasing R&D investment in underlying technologies such as silicon photonics engines, advanced packaging and high-density optical design, delivering technology-leading optical interconnect products to global markets. Going forward, Accelink will continue to follow the global wave of AI compute infrastructure development, remain driven by technological innovation, and keep iterating its high-speed optical interconnect products and system solutions. By bridging the full chain from underlying core technologies to large-scale deployment in customer scenarios and working closely with global ecosystem partners, Accelink will jointly push the optical communications industry forward.
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